Electro Magnetic Applications, Inc. (EMA) and Ansys are collaborating to deliver an enhanced design-to-validation workflow to assess and manage risks associated to material charging in space plasma ...

Under a cooperative research and development agreement, Ansys and L3Harris Technologies are working with the U.S. Army Combat Capabilities Development Command (CCDC) Aviation & Missile Center (AvMC) ...

Ansys has collaborated with the US Army and L3Harris Technologies to improve the performance and affordability of next-generation aviation and missile system applications. ANSYS headquarters building ...

PITTSBURGH, June 11, 2020 /PRNewswire/ -- Electro Magnetic Applications, Inc. (EMA) and Ansys (NASDAQ: ANSS) are partnering to deliver an enhanced design-to-validation workflow for certifying cable ...

Two of the engineering software market’s largest players are set to join forces in a $35 billion cash-and-stock deal. Synopsys Inc., which makes chip design software, today announced that it will pay ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...

PITTSBURGH, PA, Jan 27, 2023 – The software and service improvements in Ansys 2023 R1 concentrate and amplify the incredible advantages that engineering simulation provides to multidisciplinary ...

GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...

H3C Semiconductor designers used Ansys’ comprehensive multiphysics platform – including Ansys SIwave, Ansys HFSS, and Ansys RedHawk-SC – to engineer a state-of-the-art network processor chip featuring ...