The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata's RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports ...
Efficient cooling is a key factor influencing the performance of compact electronic systems, which requires advanced thermal management. Microchannel Heat Exchangers (MCHEs) are increasingly becoming ...
Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...
PITTSBURGH, July 29, 2025 /PRNewswire/ -- Ansys, now part of Synopsys, (NASDAQ: SNPS) today announced 2025 R2, featuring new AI-powered capabilities across the portfolio that accelerate simulation and ...
This research explores the feasibility of using a nanocomposite from multi-walled carbon nanotubes (MWCNTs) and graphene nanoplatelets (GNPs) for thermal engineering applications. The hybrid ...
PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...
A definitive agreement for Synopsys to acquire Ansys for $35 billion could improve digital twins workflows across different engineering disciplines in chip design, physics, software, and security.
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