The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...

Au-Ge eutectic gains relevance in high-reliability packaging due to thermal stability, photonics expansion, fluxless ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

Southeast Asia and India will likely emerge as volume-based back-end assembly and test hubs, specializing in select areas of the back-end processes.

LED packaging service provider Harvatek has stepped into heterogeneous integration packaging and packaging of LED devices integrated with ICs, through cooperation with IC testing service provider ...

Feb. 19, 2026 — Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The solution provides a fast, predictable ...

SANTA CLARA, Calif., Sept. 08, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps ...

With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...

The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...