Micron Technology (NasdaqGS:MU) starts volume production of next generation HBM4 memory a quarter ahead of its prior timeline. The company reports that all of its 2026 HBM capacity is already sold out ...

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

We all know Nvidia is enjoying life as the belle of the AI ball, thanks to its hardware being the gold standard for training AI models. Now, it appears it'll be bringing its hardware partners along ...

Memory chips used to be considered low-margin commodity products. Now the industry can’t make enough to satisfy data centers’ hunger.

Micron Technology (NasdaqGS:MU) has started building a US$24b advanced wafer fabrication plant in Singapore. The facility is ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

It could allow Sony’s next-generation console to better support more complex game worlds and higher-resolution textures.

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

March 8, 2022 Timothy Prickett Morgan Compute Comments Off on A Cornucopia Of Memory And Bandwidth In The Agilex-M FPGA When it comes to memory for compute engines, FPGAs – or rather what we have ...