System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...

A technical paper titled “Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies” was published by researchers at UCSB, University of California, Santa Barbara.

After a diving accident left Jason DiSanto paralyzed from the neck down in 2009, he had to learn how to navigate life from a powered wheelchair, which he controls with a sip-and-puff system. Users sip ...

Today, we dove into the world of SIP Systems and the game-changing benefits they bring to the construction industry. As an Oahu-based wholesaler and service provider for Structural Insulated Panels ...

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...

Molinelli Architects and ST Bungalow have been granted a US patent for their Stay-In-Place (SIP) arched concrete reinforcement system, made from 100% recycled materials such as fibre-reinforced ...