SAN MATEO, Calif. ” Ziptronix, a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.) will introduce a new “engineered substrate” material Tuesday (Sept. 9) for use in ...
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...
The two companies say they are cooperating on the development of low temperature wafer bonding equipment and process technologies. Silicon Genesis Corp. (SiGen) and EV Group (EVG) said today they are ...
ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...
Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...
At the same time, the semiconductor industry has been moving toward 200 mm (8-inch) wafers to improve manufacturing ...
Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results