Cirrus Logic expands its portfolio of pro audio converters, delivering high audio quality at an affordable price.

TDK showcases its suite of sensing solutions, including MEMS IMUs, MEMS microphones, and ultrasonic ToF sensors at Sensors ...

BrainChip and HaiLa collaborate to deliver ultra-low-power edge AI connectivity for IoT sensor applications. BrainChip ...

The xMEMS µCooling fan-on-a-chip platform claims the first in-frame active cooling for AI-powered wearables. xMEMS Labs, Inc.

Researchers are exploring new materials and ways to improve supercapacitors to fill gaps left by more conventional power ...

Molex’s TrackLabel printable BLE smart label platform with real-time location tracking targets a range of applications.

TE Connectivity’s MULTIGIG FO transceiver platform enables customizable system designs for military, aerospace, and marine ...

Microchip’s dsPIC33A digital signal processors with specialized peripherals tackle power conversion challenges in AI servers.

Harwin’s U.S. connector survey reveals the importance of product reliability in demanding applications such as automotive, ...

GigaDevice’s entry-level MCUs with the Arm Cortex-M23 core deliver 10% higher performance and clock speeds up to 48 MHz.

Q-Tech’s QT2020/QT2021 MCXOs deliver expanded PPB stability levels and optimized size, weight, and power for New Space ...

NXP and Rimac jointly develop a centralized architecture for SDVs, consolidating more than 20 ECUs into three units.