Thankfully, much of what we didn’t love about the previous model has been addressed through a refresh of the MDX for the 2025 model year. Every MDX now gets Acura’s new standard 12.3-inch touchscreen ...

*Estimated payments are calculated by Cars.com and are for informational purposes only. We’ve estimated your taxes based on your provided ZIP code. These estimates do not include title, registration ...

*Estimated payments are calculated by Cars.com and are for informational purposes only. We’ve estimated your taxes based on your provided ZIP code. These estimates do not include title, registration ...

There are more updates that are appealing for this three-row luxury SUV from Acura, but man are we glad that one specific ...

Get an online offer in 2 minutes using our Sell My Car tool. Actual price and payments may be different due to local rebates, specials, fees, and credit qualifications. Consult your dealer for actual ...

Is the Genesis GV80’s luxury, tech, and warranty worth the $7k more than the Acura MDX? See how these two 2025 SUVs stack up.

Standard equipment includes the features that come with this vehicle. Select Your Options Choose options to include in this vehicle value. For the most accurate pricing and values on new or used ...

Luxury three-row SUVs appeal to drivers who want a premium vehicle with added cargo and seating capacity. With reasonable gas ...

Acura’s newest, cheapest and smallest crossover proves that small SUVs don’t have to be boring. In today’s complicated automotive market, it would feel a little disingenuous not to point out that the ...

How chips are used is changing, and so are the requirements. In the past, markets were largely segmented by application, which determined how chips were designed. High-performance processors went into ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...