The engineer decides to make a virtual twin (process model) of the etch process to mimic the actual behavior of the wafer ...
AI and capacitive micromachined ultrasonic transducer chips are making diagnostics faster and more accessible.
A new approach enhances AI understanding through hierarchical clustering techniques with LLM-driven keyphrase extraction.
Photo: eBeam Initiative panel discussion at the 2025 BACUS SPIE Photomask Conference.
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