The engineer decides to make a virtual twin (process model) of the etch process to mimic the actual behavior of the wafer ...

AI and capacitive micromachined ultrasonic transducer chips are making diagnostics faster and more accessible.

DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, ...

A new approach enhances AI understanding through hierarchical clustering techniques with LLM-driven keyphrase extraction.

Photo: eBeam Initiative panel discussion at the 2025 BACUS SPIE Photomask Conference.

Heterogeneous integration is more than a technical milestone—it’s a strategic enabler of the next wave of digital ...

A new technical paper titled “Three-dimensional integrated hybrid complementary circuits for large-area electronics” was published by researchers at KAUST, Imperial College London and the University ...

Full-blown process excursions that affect every wafer are comparatively easy for fabs to detect and fix. However, “onesie-twosie,” lower-volume excursions can go unresolved for months or even years.

The enormous computing demands of AI and high-performance computing (HPC) applications are putting intense pressure on every ...

Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...

Researchers focus on limiting data movement to reduce power and latency in edge devices. In popular media, “AI” usually means ...

At the same time, all of this is being enabled by advancements in AI chips and algorithms, a virtuous cycle of smarter ...